MASK FOR SETTLING CONDUCTIVE BALL

摘要

PROBLEM TO BE SOLVED: To form conductive bumps for connecting electronic components on electrodes surfaces by settling conductive balls on an electrode surface through a mask, using a squeegee such that one conductive ball surely is dropped into the opening of a mask, and extra conductive balls are scraped off. SOLUTION: The mask for setting conductive balls has a basic pattern composed of all opening groups provided recessively on both surfaces (electrode side and squeegee side) of a layer (first layer) having openings for passing conductive balls, and steps provided projectively on other regions than the basic pattern. The projective portions of the steps are made from a metal plating layer formed by electroplating on the first layer. COPYRIGHT: (C)2005,JPO&NCIPI