| 摘要 |
PROBLEM TO BE SOLVED: To provide copper foil for a printed circuit board in which the adhesion between the shiny face therein and a resist is excellent, and further, whose profile is reduced by improving its adhesive strength in the case of being tightly stuck with a resin substrate in the shiny face at a low cost. SOLUTION: In the electrolytic copper foil, the shiny face foil is provided with pulse-like irregularity with indefinite length formed by electrolytic polishing. In the electrolytic polishing method for the shiny face of electrolytic copper foil, using a sulfuric acid-copper sulfate bath as an electrolytic solution, the shiny face of the electrolytic copper foil is subjected to electrolytic polishing treatment. In the electrolytic polishing method for the shiny face of electrolytic copper face, an anode is arranged at the rough surface side of the electrolytic copper foil, a cathode is arranged at the shiny face side, and electrolytic treatment is performed, thus the rough surface of the copper foil is subjected to smooth plating treatment, and further, the shiny face of the copper foil is subjected to reverse electrolytic polishing treatment. COPYRIGHT: (C)2005,JPO&NCIPI
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