发明名称 Imprint lithography for superconductor devices
摘要 One aspect of this disclosure relates to a method of building a superconductor device on a substrate, comprising depositing an imprint layer on at least a portion of the subdtrate. The imprint layer is imprinted to provide an imprinted portion of the imprint layer and a non-imprinted portion of the imprint layer. A superonductor layer is deposited on at least a portion of the imprint portion of the imprint layer.
申请公布号 US2005197254(A1) 申请公布日期 2005.09.08
申请号 US20050119034 申请日期 2005.04.30
申请人 STASIAK JAMES;KORNILOVICH PAVEL 发明人 STASIAK JAMES;KORNILOVICH PAVEL
分类号 G03F7/00;G06N99/00;H01L39/24;(IPC1-7):H01L39/00 主分类号 G03F7/00
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