| 摘要 |
The invention is a method of bonding a ceramic part ( 6 ) to a metal part ( 4 ) by heating a component assembly ( 2 ) comprised of the metal part ( 4 ), the ceramic part ( 6 ), and a thin laminated interlayer material ( 8 ) placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed within the laminated interlayer material ( 8 ) or between the metal part ( 4 ) and the laminated interlayer material ( 8 ), but that is less than the melting point of the ceramic part ( 6 ) or of the metal part ( 4 ). The component assembly ( 2 ) is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a strong bond between the ceramic part ( 6 ) and the metal part ( 4 ). The compact interlayer material ( 8 ') may be further comprised of two or more sets of metal alloy spheres ( 16, 16 ') each having distinct compositions. Further, the compact interlayer material ( 8 ') may be formed of composite spheres ( 19 ) that are each comprised of laminant layers ( 18, 40 ) where each laminant layer has a distinct composition.
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