| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a heatsink in which a cost is low, the heat conductivity is good, an initial strength of a fixed value or more is held, while a softening temperature is relatively at a high level and further the reliability in a solder joint for a joint board or semiconductor device is good, and its thickness is 2 mm or more. <P>SOLUTION: The heatsink for the semiconductor device made of copper-based alloy contains, in terms of mass%, P of 0.05% or less, and an M element and P of 0.065 to 0.3% (wherein M denotes at least one kind of Fe, Co and Ni), and the remainder is composed of copper and an inevitable impurity. The heatsink has a metal formation in which an M-P series compound is dispersed in a copper matrix, and the heat conductivity is 340 W/mk or more, Vickers hardness is HV100 or more, and the Vickers hardness after heating at 400°C for 30 minutes is 80% or more of the Vickers hardness before heating. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
