| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a high breakdown voltage and high reliability, by preventing cracks or chipping in a chip, in the element partitioning process of the mesa-type semiconductor device having glass coating. SOLUTION: The manufacturing method of the mesa-type semiconductor device comprises a coating process of grooves for separating between the elements by glass coating, and a process of partitioning respective elements by cutting the central part of the grooves by a dicing blade. The feeding speed of dicing in the dicing blade is kept so as to be a low speed in the initial stage of cutting, and the cutting is carried out by gradually increasing the dicing speed thereafter. COPYRIGHT: (C)2005,JPO&NCIPI |
