THREAD, METHOD OF MANUFACTURING IT, AND SHEET

摘要

PROBLEM TO BE SOLVED: To reduce possibility of breakage of an IC chip even when it is used while being affixed to securities, bank bill, etc.

SOLUTION: A thread is configured to mount an IC chip 10 capable of reading out at least information in a noncontact condition onto a belt-like resin layer 20. The IC chip 10 is held between the resin layer 20 and a paper layer 50 in a state that the IC chip 10 is bonded to the resin layer 20 by a hotmelt layer 30.

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