| 发明名称 |
POLISHING PAD HAVING RELEASABLE SLICK PARTICLES |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad that allows improved planarization to be obtained in polishing of a semiconductor substrate while requiring minimal conditioning. <P>SOLUTION: A polishing pad comprises a polishing layer constituting a polishing surface. The polishing layer includes particles disposed in a polymeric matrix. The particles are coated with a material having a surface tension of less than 50 dyn/cm. The coated particles are capable of being released from the polishing surface during polishing. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2005244215(A) |
申请公布日期 |
2005.09.08 |
| 申请号 |
JP20050029984 |
申请日期 |
2005.02.07 |
| 申请人 |
ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC |
发明人 |
DUONG CHAU H |
| 分类号 |
B24B37/00;B24B37/04;B24D3/34;B24D13/14;B44C1/22;C09K3/14;H01L21/304 |
主分类号 |
B24B37/00 |
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