发明名称 AIRTIGHT SEALING PACKAGE FOR ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an airtight sealing package having high airtight sealing reliability and superior productivity at a low cost. <P>SOLUTION: A first cap 10 is joined to a cavity part 2b constituting a package body by using a sealing member 14 such as solder. Here, in order to attain the state of communicating the inside and outside of the package, the first cap 10 is provided with a through-hole 11 extended in the thickness direction. Then, a photosetting resin is poured into the through-hole 11. Thereafter, the through-hole 11 is closed, by setting the photosetting resin by irradiating it with ultraviolet rays. Further, the through-hole 11 is covered with a second cap 10 jointed to the first cap 10 and a sealing member 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005244032(A) 申请公布日期 2005.09.08
申请号 JP20040053645 申请日期 2004.02.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIZAKI MITSUNORI;KITAMURA YOICHI;NAKAZATO TAKESHI
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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