| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board and the manufacturing method of the same having a wiring structure which has solved a problem that danger of separating the wiring is lowered and migration is hardly generated while securing connecting property with a semiconductor element or the like upon forming a minute wiring, in the printed circuit board constituted of an insulating layer and a conductor layer which are laminated sequentially, and wiring circuits communicated with respective conductor layers through conductor passages. <P>SOLUTION: In the printed circuit board, the wiring is formed on the insulating layer on the surface of the printed circuit board, and a positional relation between one part of the wiring and the insulating layer forming an insulating substrate is under a condition that one part of bottom surface of the wiring is buried into the peripheral insulating layer and the height position of surface of the insulating layer is formed between the height position of bottom surface of the wiring and the height position of upper surface of the wiring while the height position of the section of wiring with maximal width or the sharpened and projected part such as corners or the like is not formed at the height position of the same plane as that of surface of the insulating layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
