| 摘要 |
PROBLEM TO BE SOLVED: To precisely stick a pressure sensitive adhesive sheet on a semiconductor wafer with uniform pressurizing force in a pressure sensitive adhesive sheet sticking method for sticking the pressure sensitive adhesive sheet to the semiconductor wafer adsorbed and held by a chuck table through a sticking roller. SOLUTION: The width of a recessed part 13 existing on the wafer installation face S of the chuck table 5 is set to be within 1 mm, and the semiconductor wafer W is adsorbed and held by the wafer installation face S. The pressure sensitive adhesive sheet supplied on the semiconductor wafer is stuck on a wafer surface by rolling movement of the roller. COPYRIGHT: (C)2005,JPO&NCIPI |
