| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit unit whereby an electronic component can be processed on one surface and both surfaces of a collection substrate and high versatility and productivity are obtained. SOLUTION: The method of manufacturing the electronic circuit unit comprises a placing step of placing a collection substrate 2 on the top surface 1c of the partition wall 1b of a processing table 1 in a state that an electronic component 4 is stored in a concave portion 1a or the electronic component 4 is positioned on the concave portion 1a, a sucking step of sucking the collection substrate 2 through a hole 1d, and a cutting step of cutting the collection substrate 2 by a cutting tool on the position of the top surface 1c of the partition wall 1b. Thus, the placing process can be performed on the processing table 1 in a state that the electronic component 4 on one surface of the collection substrate 2 is positioned in or on the concave portion 1a, versatility is obtained on the processing table 1, and flexible processing can be performed. COPYRIGHT: (C)2005,JPO&NCIPI
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