发明名称 THERMOSETTING PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND THERMOSETTING PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting pressure-sensitive adhesive composition which can exhibit good tackiness before curing and can exhibit excellent adhesion and heat resistance after curing by heating. SOLUTION: The thermosetting pressure-sensitive adhesive composition comprises 100 pts. wt acrylic polymer (X) containing, as monomer components, 60-75 wt.%, based on the total amount of the monomer components, alkyl (meth)acrylate (a) whose alkyl group has 2-14 carbon atoms, 20-35 wt.%, based on the total amount of the monomer components, cyano group-containing monomer (b), and 0.5-10 wt.%, based on the total amount of the monomer components, carboxy group-containing monomer (c) and 1-20 pts. wt. phenol based resol type phenolic resin (Y) represented by formula (1) (wherein R<SP>1</SP>is -CH<SB>2</SB>- or -CH<SB>2</SB>-O-CH<SB>2</SB>-; n is a positive integer; and m is an integer of 1-4). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005239830(A) 申请公布日期 2005.09.08
申请号 JP20040049900 申请日期 2004.02.25
申请人 NITTO DENKO CORP 发明人 SONOBE MIYOKO;OURA MASAHIRO
分类号 C09J7/00;B32B7/12;C08L61/06;C09J7/02;C09J133/00;C09J133/06;C09J133/14;C09J133/18;C09J133/20;C09J161/06;C09J161/10;H05K1/00;H05K3/38;(IPC1-7):C09J133/06 主分类号 C09J7/00
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