| 摘要 |
A wire bonding method for connecting a bonding wire comprised of gold to a bonding pad comprises pressing the bonding wire against the bonding pad under a load of 78.4x10<SUP>-3 </SUP>N or less, while heating the bonding wire at a temperature of 100° C. or lower, and applying ultrasonic waves having a frequency of 100 to 120 KHz and an amplitude of 0.5 to 6 mum, thereby connecting the bonding wire to the bonding pad.
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