Electroplating system and method

摘要

The present invention includes a method of electroplating an object, where the objects are stacked in at least one sleeve and the objects have an interior surface, that upon stacking, form a stack conduit. The sleeves are then racked to provide fluid communication between a plating solution reservoir and the stack conduit. Plating of the inner surfaces of the objects occurs by flowing an electroplating solution from the reservoir through the stack conduit in the presence of a current. The present invention also includes systems for carrying out the above method.