发明名称 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
摘要 First and second electrodes and first and second electrical connection portions are overlapped and electrically connected. A first substrate includes: an attachment portion, a connection portion and an extension portion, the attachment portion being attached to the second substrate, the connection portion being connected to the attachment portion and positioned outside the second substrate, and the extension portion being extending from the connection portion along an edge of the second substrate without overlapping the second substrate. The first electrical connection sections are formed on the extension portion of the first substrate.
申请公布号 US2005196981(A1) 申请公布日期 2005.09.08
申请号 US20050099390 申请日期 2005.04.04
申请人 SEIKO EPSON CORPORATION 发明人 HASHIMOTO NOBUAKI
分类号 G02F1/1345;G02F1/13;G09F9/00;H01L21/56;H01L21/60;H01L23/48;H01L23/498;H05K1/14;H05K3/36;(IPC1-7):H01R12/00 主分类号 G02F1/1345
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