CIRCUIT BOARD, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To secure an excellent connection state between a circuit chip and a wiring board.

SOLUTION: A circuit board comprises: a substrate (10) including wiring (14); a thin film circuit chip (20) which includes a thin film circuit and is disposed on the substrate; an electrode pad (21) which is provided on one surface of the thin film circuit chip and serves as electrical connection between the thin film circuit and a predetermined connecting portion of the wiring; and a plurality of conductive particles (22) interposed between the connecting portion of the wiring and the electrode pad. At least the side of the electrode pad abutted with the substrate is formed to have hardness relatively higher than those of the conductive particles so as not to deform a crimped portion when one of the conductive particles is crimped.

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