| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus and a manufacturing method thereof capable of improving the cross section at a conductive portion, constituting a portion of a wiring layer in a cutting process for cutting and separating an electronic apparatus. <P>SOLUTION: In this electronic apparatus, after electronic components mounted on a multi-layer wiring board 10 are covered with resin, cutting processing is carried out at a predetermined cutting position to bring it into individual pieces. In the multi-layer wiring board 10, respective layers on the substrates 20, 30 have wiring layers 21, 22, 31, 32 for forming electronic components and circuits, an external output terminal unit 4, and a conductive part 22a formed at the predetermined cutting position and used for electrical conduction, to apply electrolytic plating to the external output terminal unit 4. The layer 20 having a predetermined hardness is disposed at a position lower than the conductive part 22a in the direction of the cutting processing. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
