| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-pattern wiring board which can prevent warpage in a thin and wide ceramic mother board, also can manufacture a plurality of wiring boards having excellent electrical reliability which are arranged in vertical and horizontal directions, and surely can form a wiring board resulting in no missing or crack at the time of dividing the same. SOLUTION: The multi-pattern wiring board is provided with a mother board 1 where square wiring board regions 2 are arranged in the vertical and horizontal directions at the central area of the main surface, and a frame type spoil allowance region 5 is formed at the external circumferential part, a wiring conductor formed at each wiring board region 2, a groove 3 formed at the spoil allowance region 5 to surround the entire part of the wiring board region 2, and a conductive layer 4 formed at the bottom surface of the groove 3. COPYRIGHT: (C)2005,JPO&NCIPI
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