| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having a good curability, preservability and flowability and a semiconductor device excellent in solder crack resistance and reliability in moisture resistance. SOLUTION: This epoxy resin composition contains (A) a compound having≥2 epoxy groups in one molecule, (B) a compound having≥2 phenolic hydroxy groups in one molecule and (C) an organosilane compound expressed by general formula (1) [wherein, R<SP>1</SP>to R<SP>3</SP>are each any of a 1-4C monovalent alkyl, a 1-4C alkoxy or a 6-12C aryl, and are the same or different; R<SP>4</SP>is a 1-6C divalent hydrocarbon group; Ar<SP>1</SP>is a substituted or non-substituted n-valent aromatic group; and (n) is 1-3 integer]. COPYRIGHT: (C)2005,JPO&NCIPI
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