The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300 DEG C or less and a resin(s). <IMAGE>
申请公布号
EP1571680(A1)
申请公布日期
2005.09.07
申请号
EP20030777414
申请日期
2003.12.09
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;NAMICS CORPORATION