发明名称 |
ELECTRONIC DEVICE |
摘要 |
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard. <IMAGE> |
申请公布号 |
EP1571706(A1) |
申请公布日期 |
2005.09.07 |
申请号 |
EP20030811481 |
申请日期 |
2003.06.20 |
申请人 |
HITACHI, LTD. |
发明人 |
YOKOZUKA, TAKEHIDE;HARADA, MASAHIDE;YAMASHITA, SHIRO;UCHIYAMA, KAORU;EGUCHI, SHUJI;ASANO, MASAHIKO;SATO, KOJI |
分类号 |
H05K7/20;H01L23/12;H01L23/14;H01L23/36;H01L23/367;H01L23/498;H05K1/02;H05K1/05;H05K1/18;H05K3/34;H05K3/46 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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