Electronic devices and production methods

摘要

An electronic device (10) having mounted thereon an MEMS element (4) or other functional elements, in which a device body (1) and a lid (2) define an element-carrying space (8). The element carrying space (8) is sealed airtight by an ultrasonic bonded part (3) bonding the device body (1) and the lid (2). The element-carrying space (8) has arranged inside it a system element (4) secured to the device body (1) and/or the lid (2) by a flip-chip connection (27, 31).