发明名称 Thin surface mounted type solid electrolytic capacitor
摘要 An external cathode terminal (16) is adhered to one surface of a capacitor element while a prepreg (25) is adhered to another surface of the capacitor element. A reinforcement plate (26) is adhered to the prepreg. Heat and pressure are applied to the external cathode terminal, the prepreg, and the reinforcement plate to elute thermosetting resin from the prepreg in the side of the capacitor element, thereby sealing the side of the capacitor element with eluted material (27A, 27B). Inasmuch as transfer molding is not used as exterior package, the element never deforms by injection pressure of resin. It is possible to thin by a thickness of exterior package resin. Inasmuch as eluted thermosetting resin does not include a mold release agent, it has good adhesion for the external cathode terminal.
申请公布号 GB2394360(B) 申请公布日期 2005.09.07
申请号 GB20030016903 申请日期 2003.07.18
申请人 * NEC TOKIN CORPORATION 发明人 SATOSHI * ARAI;TAKAYUKI * INOI;YOSHIHIKO * SAIKI;SADAMU * TOITA
分类号 H01G9/08;H01G2/06;H01G2/08;H01G2/10;H01G4/06;H01G4/224;H01G4/35;H01G9/00;H01G9/042;H01G9/15;(IPC1-7):H01G9/08 主分类号 H01G9/08
代理机构 代理人
主权项
地址