manufacture for an outer terminal of array type chip package,申请号KR20030078635-传众专利搜索

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发明名称	manufacture for an outer terminal of array type chip package
摘要
申请公布号	KR100513322(B1)	申请公布日期	2005.09.07
申请号	KR20030078635	申请日期	2003.11.07
申请人		发明人
分类号	H01L23/52;(IPC1-7):H01L23/52	主分类号	H01L23/52
代理机构		代理人
主权项
地址

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