发明名称 |
SINGLE PACKAGE MULTI-CHIP RF POWER AMPLIFIER |
摘要 |
Disclosed are a multi-chip power amplifier comprising a plurality chips with each chip being a transistor amplifier, and a housing in which all of the semiconductor chips are mounted. A plurality of input leads extend into the housing and a plurality of output leads extend from the housing. A plurality of first matching networks couple a semiconductor chip to an input lead and a plurality of second matching networks couple each semiconductor chip to an output lead whereby each chip has its own input lead and output lead. By providing all amplifier chips within a single housing with matching networks within the housing coupling the chips to the input and output leads, manufacturing cost is reduced and the overall package footprint on a mounting substrate is reduced. Further, the close proximity of the chips within the housing reduces phase differences among signals in the semiconductor chips. |
申请公布号 |
EP1570572(A1) |
申请公布日期 |
2005.09.07 |
申请号 |
EP20030790018 |
申请日期 |
2003.11.24 |
申请人 |
CREE MICROWAVE, LLC |
发明人 |
PENGELLY, RAYMOND, SYDNEY;WOOD, SIMON, MAURICE;QUINN, JOHN, PHILLIP |
分类号 |
H01L23/66;H01L25/07;H03F3/60 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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