发明名称 Integrated circuits and interconnect structure for integrated circuits
摘要 An integrated circuit according to the present invention includes first, second and third plane-like metal layers. A first transistor has a first control terminal and first and second terminals. The second terminal communicates with the first plane-like metal layer. The first terminal communicates with the second plane-like metal layer. A second transistor has a second control terminal and third and fourth terminals. The third terminal communicates with the first plane-like metal layer. The fourth terminal communicates with the third plane-like metal layer. A fourth plane-like metal layer includes first, second and third contact portions that are electrically isolated from each other and that are connected to the second plane-like metal layer, the first plane-like metal layer and the third plane-like metal layer, respectively.
申请公布号 EP1571708(A2) 申请公布日期 2005.09.07
申请号 EP20050000284 申请日期 2005.01.07
申请人 MARVELL WORLD TRADE LTD. 发明人 SUTARDJA, SEHAT
分类号 H01L21/768;H01L21/3205;H01L21/82;H01L21/822;H01L23/367;H01L23/482;H01L23/485;H01L23/52;H01L23/528;H01L23/538;H01L27/04;H01L27/092 主分类号 H01L21/768
代理机构 代理人
主权项
地址