发明名称 |
Surface acoustic wave device and method for manufacturing the same |
摘要 |
A surface acoustic wave device (50) includes a piezoelectric substrate (1), an interdigital transducer (IDT) electrode (2), and a connecting portion (3) that is electrically connected with the IDT electrode (2). The surface acoustic wave device (50) further includes a wiring portion (4), a portion of which is disposed on the connecting portion (3), and a bump (5) disposed on the wiring portion (4). The connecting portion (3) includes a comb-shaped portion (6) at an end of the connecting portion (3) on which the wiring portion (4) is disposed. <IMAGE> |
申请公布号 |
EP1517442(A3) |
申请公布日期 |
2005.09.07 |
申请号 |
EP20040292103 |
申请日期 |
2004.08.27 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SAKAGUCHI, KENJI;AKIYAMA, KENJI |
分类号 |
H03H9/25;H03H3/08;H03H9/05;H03H9/145 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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