发明名称 Surface acoustic wave device and method for manufacturing the same
摘要 A surface acoustic wave device (50) includes a piezoelectric substrate (1), an interdigital transducer (IDT) electrode (2), and a connecting portion (3) that is electrically connected with the IDT electrode (2). The surface acoustic wave device (50) further includes a wiring portion (4), a portion of which is disposed on the connecting portion (3), and a bump (5) disposed on the wiring portion (4). The connecting portion (3) includes a comb-shaped portion (6) at an end of the connecting portion (3) on which the wiring portion (4) is disposed. <IMAGE>
申请公布号 EP1517442(A3) 申请公布日期 2005.09.07
申请号 EP20040292103 申请日期 2004.08.27
申请人 MURATA MANUFACTURING CO., LTD. 发明人 SAKAGUCHI, KENJI;AKIYAMA, KENJI
分类号 H03H9/25;H03H3/08;H03H9/05;H03H9/145 主分类号 H03H9/25
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