发明名称 |
Impedance matched electrical interconnect using dielectric compounds |
摘要 |
An improved electrical interconnect is formed wherein a dielectric material having a controllable characteristic is applied to at least a portion of the interconnect. The controllable characteristic of the dielectric material is selectively adjustable so that the impedance of the electrical interconnect is substantially matched to at least one impedance at first and second ends of the interconnect. In this manner, an electrical discontinuity between the first and second ends of the electrical interconnect is reduced, thereby improving an electrical performance of the interconnect. |
申请公布号 |
US6940165(B2) |
申请公布日期 |
2005.09.06 |
申请号 |
US20020241403 |
申请日期 |
2002.09.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
OPRYSKO MODEST M.;SHAN LEI;TREWHELLA JEANNINE M. |
分类号 |
H01L23/495;H01L23/64;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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