发明名称 |
Method and apparatus of sealing wafer backside for full-face electrochemical plating |
摘要 |
The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.
|
申请公布号 |
US6939206(B2) |
申请公布日期 |
2005.09.06 |
申请号 |
US20020159295 |
申请日期 |
2002.05.31 |
申请人 |
ASM NUTOOL, INC. |
发明人 |
ASHJAEE JALAL;TALIEH HOMAYOUN;BASOL BULENT M.;VOLODARSKY KONSTANTIN |
分类号 |
B24B37/04;B24B37/30;C25D7/12;C25D17/00;C25D17/06;H01L21/00;H01L21/304;H01L21/306;H01L21/683;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|