Method and system for optical packaging

摘要

Method and system for an optical package are disclosed. In one embodiment of the present invention, an optical package comprises: a lead frame; a substrate mounted inside the lead frame; one or more leads attached to the substrate; an optical device or component such as a LOA chip mounted on top of the substrate; a window cap hermetically sealing the optical device or component; one or more lens attached to either side of the window cap; two fibers attached on either side of the window cap; two holes or vias that may serve as inputs into the window cap or outputs from the window cap; an electrical out extending from the window cap; and an electrically isolated enclosure enveloping all contents inside the lead frame.