Method of wafer level chip scale packaging

摘要

The invention includes a method of wafer level chip scale packaging including providing a semiconductor device having a silicon based substrate with discrete devices defined therein and a contact pad near an upper surface thereof, a passivation layer overlying the silicon based substrate and the contact pad, and the passivation layer having an opening therein exposing at least a portion of the contact pad, and a redistribution trace electrically connected to the contact pad near a first end and having a second end of spaced a distance from the contact pad. Forming an encapsulation layer over the semiconductor device including the redistribution trace. Forming an opening in the encapsulation layer down to the redistribution trace. Forming a contact post in the opening in the encapsulation layer, and the contact post having a first end electrically connected to the redistribution trace and a second exposed end. Forming an electrically conductive bump on the semiconductor device and in electrical contact with the contact post.