| 摘要 |
A heat dissipation device includes a base ( 10 ), a post ( 20 ), a plurality of fins ( 50 ), a pair of heat pipes ( 30 ) and a pair of plates ( 40 ). The base is for contacting an electronic component. Each fin defines an aperture ( 52 ) therein. When the fins are parallelly stacked upon the base, the apertures cooperatively define a channel. The post is extended perpendicularly from the base and received in the channel. The post defines a pair of through holes ( 21 ) along a length direction thereof. The plates are located at opposite peripheries of the stacked fins and parallel to the post. Each plate defines an engaging hole ( 41 ) therein. Each heat pipe is substantially inverted U-shaped and includes parallel first and second section ( 32, 34 ) respectively soldered into a corresponding through hole of the post and the engaging hole of a corresponding plate.
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