发明名称 |
Method for fabricating a filament affixed trace within an electronic device |
摘要 |
A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.
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申请公布号 |
US6938331(B2) |
申请公布日期 |
2005.09.06 |
申请号 |
US20030703122 |
申请日期 |
2003.11.06 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
DEBLANC JAMES J.;DICKEY DAVID;CHERNISKI ANDREW MICHAEL |
分类号 |
H01P3/08;H05K1/02;(IPC1-7):H01R43/00 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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