发明名称 System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
摘要 UV molding from elastomeric masters on thin bendable backplanes that allow replication of UV-cured resist patterns with high accuracy is disclosed. This design accommodates large substrate topographies, has improved de-molding properties, and facilitates two-in-one lithography and assembly of the sliders on topographically structured elastomeric sticky pads. The combination of sticky pad assembly and two-in-one lithography allows an all-in-one harmony process based on UV-molding. These features cure prior art technical problems of the harmony process while significantly reducing cost.
申请公布号 US2005191418(A1) 申请公布日期 2005.09.01
申请号 US20040787476 申请日期 2004.02.26
申请人 HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B. V. 发明人 BIETSCH ALEXANDER;CHAW MICHAEL W.;LAHIRI ASHOK;MCFADYEN IAN R.;MICHEL BRUNO;THURBER MARK C.
分类号 B05D5/00;G03F7/00;(IPC1-7):B05D5/00 主分类号 B05D5/00
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