发明名称 |
System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning |
摘要 |
UV molding from elastomeric masters on thin bendable backplanes that allow replication of UV-cured resist patterns with high accuracy is disclosed. This design accommodates large substrate topographies, has improved de-molding properties, and facilitates two-in-one lithography and assembly of the sliders on topographically structured elastomeric sticky pads. The combination of sticky pad assembly and two-in-one lithography allows an all-in-one harmony process based on UV-molding. These features cure prior art technical problems of the harmony process while significantly reducing cost.
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申请公布号 |
US2005191418(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
US20040787476 |
申请日期 |
2004.02.26 |
申请人 |
HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B. V. |
发明人 |
BIETSCH ALEXANDER;CHAW MICHAEL W.;LAHIRI ASHOK;MCFADYEN IAN R.;MICHEL BRUNO;THURBER MARK C. |
分类号 |
B05D5/00;G03F7/00;(IPC1-7):B05D5/00 |
主分类号 |
B05D5/00 |
代理机构 |
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代理人 |
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主权项 |
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