发明名称 |
System and method for reducing temperature variation during burn in |
摘要 |
Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.
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申请公布号 |
US2005192773(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
US20040791099 |
申请日期 |
2004.03.01 |
申请人 |
SHENG ERIC C.;HOFFMAN DAVID H.;NIVEN JOHN L. |
发明人 |
SHENG ERIC C.;HOFFMAN DAVID H.;NIVEN JOHN L. |
分类号 |
G01K7/42;G01R31/28;(IPC1-7):G01K1/08 |
主分类号 |
G01K7/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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