ELEMENT ARRANGEMENT CHECK DEVICE AND PRINTED CIRCUIT BOARD DESIGN DEVICE

摘要

There is provided a check device for checking an element arrangement of a printed circuit board having wiring connected to a semiconductor integrated circuit power terminal and a power decoupling element for the power terminal on a mounting surface where the semiconductor integrated circuit is mounted, and having a power wiring on a power plane which is different from the mounting surface. The check device includes: element distance detection means for detecting a first wiring length between the power decoupling element and the power terminal; power via hole distance detection means for detecting a second wiring distance between a power via hole formed for supplying DC power to the power terminal and the power terminal; and judgment means for judging the positional relationship between the power decoupling element and the power via hole with respect to the power terminal, according to the first wiring length and the second wiring length. Thus, it is possible to check the connection sequence of the connection via to the power plane for supplying DC power to the power decoupling element and the power terminal. A printed circuit board is also disclosed.