发明名称 |
Method of surface mounting a semiconductor device |
摘要 |
A surface mounting method for mounting semiconductor devices suppresses solder peeling defects which tried to occur during mounting. The method used for mounting semiconductor devices includes a process for preparing the semiconductor devices by obtaining multiple terminals by exposing a section of each of multiple leads protruding from a rear side of the plastic casing, and forming a layer of solder by solidifying a molten solder material; a process for supplying a solder paste material to multiple electrodes on a printed circuit board; and a process for melting the solder paste of the multiple electrodes and connecting each of the multiple terminals with the multiple electrodes.
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申请公布号 |
US2005189627(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
US20050065108 |
申请日期 |
2005.02.25 |
申请人 |
ITO FUJIO;SUZUKI HIROMICHI;MIWA TAKASHI;TOIDA TOKUJI |
发明人 |
ITO FUJIO;SUZUKI HIROMICHI;MIWA TAKASHI;TOIDA TOKUJI |
分类号 |
H01L21/48;H01L21/56;H01L21/60;H01L23/12;H01L23/31;H01L23/495;H01L23/50;H05K1/18;H05K3/34;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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