摘要 |
The invention relates to a semiconductor component (14) comprising a stack (100) of semiconductor chips (1, 2), these semiconductor chips (1, 2) being fixed to one another with material fit. The contact surfaces (5) of the semiconductor chips (1, 2) lead up to the edges (6) of the semiconductor chip (1, 2), and conductor sections (7) extend at least from a top edge (8) to a bottom edge (9) of the edge sides (10) of the semiconductor chips (1, 2) in order to electrically connect the contact surface (5) of the stacked semiconductor chips (1, 2) to one another. |
申请人 |
INFINEON TECHNOLOGIES AG;BAUER, MICHAEL;ENGLING, THOMAS;HAIMERL, ALFRED;KESSLER, ANGELA;MAHLER, JOACHIM;SCHOBER, WOLFGANG |
发明人 |
BAUER, MICHAEL;ENGLING, THOMAS;HAIMERL, ALFRED;KESSLER, ANGELA;MAHLER, JOACHIM;SCHOBER, WOLFGANG |