Chip probing equipment and test modeling for next generation MES (300MM)

摘要

A new solution in 300 mm Chip Probing (CP) Manufacturing Execution System (MES) design based on a SiView infrastructure. It models actual behavior making it possible to specify exact test program and equipment configuration. The test program, product file, and probe card are modeled into the MES infrastructure so that extra systems and tables requiring costly maintenance can be eliminated. With the required tester configuration built into the product class and tester capability status built into the test equipment's properties, real-time lot-equipment dispatching can occur according to the configuration. A modified version can be supported by I-EDA and PCMS.