发明名称 |
Method and apparatus for implementing silicon wafer chip carrier passive devices |
摘要 |
Methods and apparatus are provided for implementing silicon wafer chip carrier passive devices including customized silicon capacitors and resistors mounted directly on a module or carrier package. A plurality of system design inputs is received for a package arrangement. A respective physical design is generated for customized passive devices, a logic chip, and a chip carrier. Silicon devices are fabricated utilizing the generated respective physical design for customized passive devices and the logic chip and a carrier package is fabricated. The fabricated silicon devices are assembled on the carrier package.
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申请公布号 |
US2005192691(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
US20040787478 |
申请日期 |
2004.02.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BARTLEY GERALD KEITH;BECKER DARRYL JOHN;DAHLEN PAUL ERIC;GERMANN PHILIP RAYMOND;MAKI ANDREW B.;MAXSON MARK OWEN;SHEETS JOHN EDWARD II |
分类号 |
G06F17/50;G06F19/00;(IPC1-7):G06F19/00 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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