| 摘要 |
The present invention provides a fabrication method for a semiconductor structure in a substrate, the semiconductor structure having at least two regions that are to be patterned differently. A fabrication of a patterned first region in the substrate, so that the semiconductor structure has a non-patterned second region and the patterned first region, is followed by a deposition of a cover layer that grows over the patterned first region, so that the cover layer above the patterned first region forms a closure, which covers over the patterned first region. This is followed by a fabrication of the patterned second region, the patterned first region remaining protected at least by the closure of the cover layer. The final step effected is a removal of the cover layer above the semiconductor structure, which now has two differently patterned regions.
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