The composition of a organic (e.g. conducting polymer) solution is reformulated and the device upon which the organic solution is to be deposited is plasma treated to provide a more uniform and flat drying profile for the resulting dried film. The reformulated organic solution comprises a mixture of base organic solution and humectants. This reformulation and treatment induces a more uniform and flatter profile when the reformulated organic solution is allowed to dry into a film on the treated device.
