发明名称 Negative photosensitive resin composition
摘要 A negative photosensitive resin composition comprising an alkali-soluble photosensitive resin (A) having acidic groups and having at least three ethylenic double bonds per molecule, an ink repellent (B) made of a polymer having polymerized units (b1) having a C<SUB>20 </SUB>or lower alkyl group in which at least one of its hydrogen atoms is substituted by a fluorine atom (provided that the alkyl group may contain etheric oxygen), and polymerized units (b2) having an ethylenic double bond, and a photopolymerization initiator (C), wherein the fluorine content in the ink repellent (B) is from 5 to 25 mass %, and the proportion of the ink repellent (B) is from 0.01 to 20 mass %, based on the total solid content of the negative photosensitive resin composition. The negative photosensitive resin composition of the present invention is excellent in adhesion to a substrate, ink repellency and durability thereof and further excellent in alkali solubility and developability.
申请公布号 US2005191580(A1) 申请公布日期 2005.09.01
申请号 US20050121203 申请日期 2005.05.04
申请人 ASAHI GLASS COMPANY LIMITED 发明人 TAKAHASHI HIDEYUKI;ISHIZEKI KENJI
分类号 G03C1/492;G03F7/004;G03F7/027;G03F7/033;G03F7/038;(IPC1-7):G03C1/492 主分类号 G03C1/492
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