发明名称 Punched grid arrangement for automobile, has printed circuit board with conductor unit having rest medium and widened conductor path for dissipation of heat from electrical and/or electronic units
摘要 <p>The arrangement has a printed circuit board (PCB) (2) connected with a punched grid area and including a conductor unit (3a) with a rest medium (3b). The PCB has electrical and/or electronic units and a widened conductor path for dissipation of heat from the electrical and/or electronic units, where path has a width of about 5 millimeters. The electrical and electronic units are arranged in a solder path for soldering.</p>
申请公布号 DE102004008554(A1) 申请公布日期 2005.09.01
申请号 DE20041008554 申请日期 2004.02.19
申请人 TALLER AUTOMOTIVE GMBH 发明人 BISSING, BORIS
分类号 H05K3/20;H05K3/30;H05K3/34;H05K3/36;(IPC1-7):H05K7/02;H05K1/02;H05K1/18 主分类号 H05K3/20
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