发明名称 |
Punched grid arrangement for automobile, has printed circuit board with conductor unit having rest medium and widened conductor path for dissipation of heat from electrical and/or electronic units |
摘要 |
<p>The arrangement has a printed circuit board (PCB) (2) connected with a punched grid area and including a conductor unit (3a) with a rest medium (3b). The PCB has electrical and/or electronic units and a widened conductor path for dissipation of heat from the electrical and/or electronic units, where path has a width of about 5 millimeters. The electrical and electronic units are arranged in a solder path for soldering.</p> |
申请公布号 |
DE102004008554(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
DE20041008554 |
申请日期 |
2004.02.19 |
申请人 |
TALLER AUTOMOTIVE GMBH |
发明人 |
BISSING, BORIS |
分类号 |
H05K3/20;H05K3/30;H05K3/34;H05K3/36;(IPC1-7):H05K7/02;H05K1/02;H05K1/18 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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