发明名称 Lead frame for connecting optical sub-assembly to printed circuit board
摘要 Lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical sub-assemblies and transceiver printed circuit boards.
申请公布号 US2005191879(A1) 申请公布日期 2005.09.01
申请号 US20040809992 申请日期 2004.03.26
申请人 ICE DONALD A. 发明人 ICE DONALD A.
分类号 H01R12/00;(IPC1-7):H01R12/00 主分类号 H01R12/00
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