发明名称 |
Method of forming an electronic device having high thermal conductivity and dielectric strength |
摘要 |
A polymer composition having high thermal conductivity and dielectric strength is provided. The polymer composition comprises a base polymer matrix and a thermally-conductive, electrically-insulating material. A reinforcing material such as glass can be added to the composition. The polymer composition can be molded into packaging assemblies for electronic devices such as capacitors, transistors, and resistors.
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申请公布号 |
US2005189522(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
US20050118056 |
申请日期 |
2005.04.29 |
申请人 |
SAGAL E. MIKHAIL;MCCULLOUGH KEVIN A.;MILLER JAMES D. |
发明人 |
SAGAL E. MIKHAIL;MCCULLOUGH KEVIN A.;MILLER JAMES D. |
分类号 |
C08K3/22;C08K3/28;H01B3/30;(IPC1-7):H01B1/00 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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