发明名称 |
POLYIMIDESILOXANE SOLUTION COMPOSITION |
摘要 |
<p>[PROBLEMS] To provide a polyimidesiloxane solution composition which is excellent in defoaming ability, and can maintain the wettability of an outer lead bonded portion on a wiring board at a high level, even when it is applied on the surface of the wiring board and then cured, to form an insulating cured film. [MEANS FOR SOLVING PROBLEMS] A polyimidesiloxane solution composition which comprises an organic solvent, curable components such as a polyimidesiloxane soluble in the organic solvent, an epoxy compound and a poly-valent isocyanate compound, and a silicone defoaming agent, wherein said silicone defoaming agent comprises dimethylpolysiloxane, a polysiloxane compound having a hydrophilic group in a side chain or a terminal moiety, and a fine powdery silica.</p> |
申请公布号 |
WO2005080505(A1) |
申请公布日期 |
2005.09.01 |
申请号 |
WO2005JP02749 |
申请日期 |
2005.02.21 |
申请人 |
UBE INDUSTRIES, LTD.;HAYASHI, KOJI;TANAKA, YOSHIKI;HIRASHIMA, KATSUTOSHI;TAKABAYASHI, SEIICHIROU |
发明人 |
HAYASHI, KOJI;TANAKA, YOSHIKI;HIRASHIMA, KATSUTOSHI;TAKABAYASHI, SEIICHIROU |
分类号 |
C08G18/61;C08K3/36;C08L79/08;C08L83/10;C09D183/10;H01L21/56;H01L23/498;H05K3/28;(IPC1-7):C08L79/08;C08L83/04;H05K3/34 |
主分类号 |
C08G18/61 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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