| 发明名称 |
FORMING A COPPER DIFFUSION BARRIER |
| 摘要 |
<p>Noble metal may be used as a non-oxidizing diffusion barrier to prevent diffusion from copper lines. A diffusion barrier may be formed of a noble metal formed over an adhesion promoting layer or by a noble metal cap over an oxidizable diffusion barrier. The copper lines may also be covered with a noble metal.</p> |
| 申请公布号 |
EP1568078(A1) |
申请公布日期 |
2005.08.31 |
| 申请号 |
EP20030779221 |
申请日期 |
2003.10.23 |
| 申请人 |
INTEL CORPORATION |
发明人 |
JOHNSTON, STEVEN;DUBIN, VALERY;MCSWINEY, MICHAEL;MOON, PETER |
| 分类号 |
H01L21/285;H01L21/288;H01L21/768;H01L23/532;(IPC1-7):H01L21/768 |
主分类号 |
H01L21/285 |
| 代理机构 |
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