摘要 |
<p>Two-part adhesive comprises a first component (C1) comprising an epoxy resin, an epoxy adduct (I), a reaction product of (I) and a polyisocyanate and a heat-activatable hardener, and a second component (C2) comprising a polyisocyanate. (I) is an adduct of a diglycidyl ether and a dicarboxylic acid and optionally a bis(aminophenyl) sulfone or aromatic alcohol. Independent claims are also included for: (1) producing a semifinished product by heating C1 to 60-130[deg]C, mixing it with C2, applying the resulting adhesive to a flat substrate, and contacting the adhesive with another flat substrate, especially under pressure; (2) semifinished product produced as above; (3) producing a sandwich composite by deforming a semifinished product as above and heating it to 130-230[deg]C; (4) sandwich composite produced as above.</p> |